Fluorinated Solvent Stable Performance

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Fluorinated Solvent is a perfluorinated liquid with high stability, high dielectric constant, ideal chemical inertness, good thermal conductivity and good system compatibility.

  Fluorinated Solvent is a perfluorinated liquid with high stability, high dielectric constant, ideal chemical inertness, good thermal conductivity and good system compatibility. Immersion cooling: Place the server in a closed box and completely immerse it in insulating liquid.

 

Attribute characteristics:

   1. Permeability: low viscosity, very low surface tension, able to penetrate small cracks, and small viscosity changes at low temperatures

  2. Chemical properties: excellent thermal conductivity, thermal stability, chemical stability

  3. Dryness: moderate boiling point, low heat of vaporization during evaporation, fast evaporation, good drying, short drying time, dehydration, and no water marks.

  4. Affect the excellent material compatibility of solid materials and will not damage the surface of plastics, resins, metals and other materials

  5. Renewability: steam sliding vane can be regenerated, reusable, and cost reduction

  6. ​​Safety: There is no ignition point and flash point, and it is not a dangerous product as stipulated in Article 7 of the Fire Protection Law.

  7, electrical insulation: insulation, does not change with temperature

  8. Use safety: non-toxic during use, gas in the air

  9. Environmental hazards: colorless, odorless, non-toxic, ozone depletion potential (ODP) is 0, global warming potential (GWP) is low, in line with environmental protection policies.

      Data center immersion cooling

     By directly immersing IT hardware in Heptafluoropropane HFC-227EA, it helps to improve its heat dissipation design. The heat generated by the electronic components is directly and efficiently transferred to the liquid, thereby reducing the need for active cooling components such as thermal interface materials, heat sinks and fans. These improvements have improved energy efficiency while allowing higher packaging densities.

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